ISSI FLASH-廣州立功科技股份有限公司

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ISSI FLASH
電子式可清除程序化只讀存儲器的形式
首頁 > 存儲、加密和NFC >ISSI FLASH

存儲、加密和NFC > ISSI FLASH

FLASH存儲器又稱閃存，它結合了ROM和RAM的長處，不僅具備電子可擦除可編程（EEPROM）的性能，還不會斷電丟失數據同時可以快速讀取數據。

功能特點
選型表
開發套件
資料下載

數據刪除不是以單個的字節為單位而是以固定的區塊為單位，區塊大小一般為256KB到20MB。閃存是電子可擦除只讀存儲器(EEPROM)的變種，EEPROM與閃存不同的是，它能在字節水平上進行刪除和重寫而不是按區塊擦寫，這樣閃存就比EEPROM的更新速度快，所以被稱為Flash erase EEPROM，或簡稱為Flash Memory。由于其斷電時仍能保存數據，閃存通常被用來保存設置信息，如在電腦的BIOS(基本輸入輸出程序)、PDA(個人數字助理)、數碼相機中保存資料等。另一方面，閃存不像RAM(隨機存取存儲器)一樣以字節為單位改寫數據，因此不能取代RAM。

寬電壓范圍支持：1.65V-3.6V
簡化PCB布線，節省空間
溫度級：-40℃-125℃
串行外圍接口（SPI）兼容
低功耗
硬件/軟件寫保護

選型表

選型表下載

Serial NOR Flash (QSPI,SPI)

Part Number	Den	Type	Vcc	Freq.(MHz)	Temp.Range	Package Type
IS25LQ025B	256K	Multi I/O Quad SPI	2.3-3.6V	33M/104	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON
IS25LQ512B	512K	Multi I/O Quad SPI	2.3-3.6V	33M/104	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON
IS25LQ010B	1M	Multi I/O Quad SPI	2.3-3.6V	33M/104	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON
IS25LQ020B	2M	Multi I/O Quad SPI	2.3-3.6V	33M/104	-40 to 125°C	SOIC,TSSOP,WSON,VVSOP,USON
IS25WQ020		Multi I/O Quad SPI	1.65-1.95V	33M/104	-40 to 125°C	SOIC,WSON,VVSOP,USON
IS25WP020D		Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON
IS25LQ040B	4M	Multi I/O Quad SPI	2.3-3.6V	33M/104	-40 to 125°C	SOIC,WSON,VVSOP,USON
IS25WQ040		Multi I/O Quad SPI	1.65-1.95V	33M/104	-40 to 125°C	SOIC,WSON,VVSOP
IS25WP040D		Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON
IS25LP080D	8M	Multi I/O SPI,QPI,DTR	2.3-3.6V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON
IS25WP080D	8M	Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON
IS25LP016D	16M	Multi I/O SPI,QPI,DTR	2.3-3.6V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON,TFBGA
IS25WP016D	16M	Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,VVSOP,WSON,USON,TFBGA
IS25LP032D	32M	Multi I/O SPI,QPI,DTR	2.3-3.6V	50M/133	-40 to 125°C	SOIC,WSON,USON,TFBGA
IS25WP032D	32M	Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,WSON,USON,TFBGA
IS25LP064A	64M	Multi I/O SPI,QPI,DTR	2.3-3.6V	50M/133	-40 to 125°C	SOIC,WSON,TFBGA
IS25WP064A	64M	Multi I/O SPI,QPI,DTR	1.65-1.95V	50M/133	-40 to 125°C	SOIC,WSON,USON,TFBGA
IS25LP128F	128M	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/166	-40 to 125°C	SOIC,WSON,TFBGA
IS25WP128F	128M	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/166	-40 to 125°C	SOIC,WSON,TFBGA
IS25LP256D	256M	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/166	-40 to 125°C	SOIC,WSON,TFBGA
IS25WP256D	256M	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/104	-40 to 125°C	SOIC,WSON,TFBGA
IS25LP512M	512M	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/133	-40 to 125°C	SOIC,WSON,TFBGA
IS25WP512M	512M	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/133	-40 to 125°C	SOIC,WSON,TFBGA
IS25LP01G	1G	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/133	-40 to 125°C	SOIC,WSON,LFBGA
IS25WP01G	1G	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/133	-40 to 125°C	SOIC,WSON,LFBGA

Twin Quad Serial NOR Flash (x8 SPI)

Part Number	Den	Type	Vcc	Freq.(MHz)	Temp.Range	Package Type
IS25DLP256M	256M	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/166	-40 to 125°C	SOIC,TFBGA
IS25DWP256M	256M	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/166	-40 to 125°C	SOIC,TFBGA
IS25DLP512M	512M	Multi I/O SPI,QPI,DTR	2.3-3.6V	80M/166	-40 to 125°C	SOIC,TFBGA
IS25DWP512M	512M	Multi I/O SPI,QPI,DTR	1.65-1.95V	80M/166	-40 to 125°C	SOIC,TFBGA

HyperFlash^TM

Part Number	Den	Type	Vcc	Freq.(MHz)	Temp.Range	Package Type
IS26KL128S	128Mb	HyperFlash^TM	2.7V-3.6V	100	-40 to 125°C	24-Ball BGA (6x8mm)
IS26KS128S	128Mb	HyperFlash^TM	1.7V-1.95V	166	-40 to 125°C	24-Ball BGA (6x8mm)
IS26KL256S	256Mb	HyperFlash^TM	2.7V-3.6V	100	-40 to 125°C	24-Ball BGA (6x8mm)
IS26KS256S	256Mb	HyperFlash^TM	1.7V-1.95V	166	-40 to 125°C	24-Ball BGA (6x8mm)
IS26KL512S	512Mb	HyperFlash^TM	2.7V-3.6V	100	-40 to 125°C	24-Ball BGA (6x8mm)
IS26KS512S	512Mb	HyperFlash^TM	1.7-1.95V	166	-40 to 125°C	24-Ball BGA (6x8mm)

Parallel (ISA) NOR Flash

Part Number	Den	Type	Vcc	Access Time (ns)	Temp.Range	Package Type
IS29GL016	16M	x8/x16	2.7-3.6V	60/70	-40 to 125°C	TSOP,BGA
IS29GL032	32M	x8/x16	2.7-3.6V	60/70	-40 to 125°C	TSOP,BGA
IS29GL064	64M	x8/x16	2.7-3.6V	60/70	-40 to 125°C	TSOP,BGA
IS29GL128	128M	x8/x16	2.7-3.6V	70	-40 to 125°C	TSOP,BGA
IS29GL256	256M	x8/x16	2.7-3.6V	70	-40 to 125°C	TSOP,BGA

SPI NAND Flash (IS37) & Automotive (IS38)

Part Number	Den	Vcc	Temp.Range	Package Type
IS37/IS38SML01G1	1G	3.3V	-40 to 105°C	16-SOIC,8-WSON

NAND Flash (IS34) & Automotive (IS35)

Part Number	Den	Vcc	Temp.Range	Package Type
IS34/IS35ML01G081	1G	3.3V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35ML01G084	1G	3.3V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35MW01G084	1G	1.8V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35MW01G164	1G	1.8V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35ML02G081	2G	3.3V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35ML02G084	2G	3.3V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35MW02G084	2G	1.8V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35MW02G164	2G	1.8V	-40°C to 105°C	48-TSOP,63-BGA
IS34/IS35ML04G081	4G	3.3V	-40°C to 105°C	48-TSOP
IS34/IS35ML04G084	4G	3.3V	-40°C to 105°C	48-TSOP
IS34/IS35MW04G084	4G	1.8V	-40°C to 105°C	48-TSOP
IS34/IS35MW04G164	4G	1.8V	-40°C to 105°C	48-TSOP

開發套件

資料下載

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